Techspray 1823-5F No-Clean Desoldering Braid [.098 x 5]

The Techspray 1823-5F is a no-clean flux, 5' x 0.09" copper desoldering braid. It leaves no ionic residues and prevents dendrite failures. Techspray No-Clean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called “dendrites”. Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products. Desoldering braid or desoldering wick is a pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder (e.g. bridging) to be removed. The soldering iron is applied to the wick as it sits on the solder joint, and when both are brought up to the solder's melting point, the flux is activated and, through capillary action from the braided design, solder is drawn up the wick.

Techspray 1823-5F No-Clean Desoldering Braid Highlights:

• Exceeds MIL-F-14256
• No-clean flux coated braid
• Anti-static spool (except where indicated)
• Cleanest wick clear, non-reactive residues
• Will not leave ionic residue avoid dendrite failure
• It can withstand the heat associated with soldering and desoldering processes
• The desoldering braid is made from high-quality materials, ensuring reliability and durability during use
• Desoldering braid features a no-clean flux formula, eliminating the need for additional cleaning after desoldering

Techspray 1823-5F No-Clean Desoldering Braid Specs:

• Brand: Techspray
• SKU: 1823-5F
• Color: Blue
• Length: 5 ft
• Width: 0.09 in
• Material: Copper
• Size: 5 ft x 0.09 in
• Flux Type: No-Clean
• ESD Safe (Yes/No): Yes
• No-Clean (Yes/No): Yes
• Product Type: Desoldering Braid
• Standards Met: MIL-F-14256, IPC Standard-J-STD-004