The IR 3100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.
Pace 8007-0586 IR3100 Infrared BGA Rework Station Highlights:
Ultra-High Precision Placement Capability
High Sensitivity Vacuum Pick
Sodr-Cam Reflow Camera
Height Adjustable Bottom-Side Preheater
High-Definition Optical Alignment System
Quad-Field Imaging for Large/Fine Pitch BGA's
Integrated Board Support Wand
Pace 8007-0586 IR3100 Infrared BGA Rework Station Specs: