Pace 8007-0574 TF 1800 BGA & SMD Total Rework System, 120V

The PACE Worldwide 8007-0574 provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work for safe, rapid solder joint reflow in virtually any component installation or removal application. Conventional resistance coil heating technology has been successfully used in convective rework station for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today's extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Pace 8007-0574 TF 1800 BGA & SMD Total Rework System Highlights:

• Requires far less power to operate
• Board support wand for easy adjustment
• Adjustable height bottom-side IR preheater
• Low thermal mass heater provides quick response heat-up and cool down
• Motor system provides smooth, high precision, repeatable movement with no drift
• Automated vision overlay systems uses a beam-splitting prism for simultaneous view of PCB pads and balls
• Provides ultimate thermal performance by its ability to instantly heat up and cool down the air temperature

Pace 8007-0574 TF 1800 BGA & SMD Total Rework System Specs:

• Brand: Pace
• SKU: 8007-0574
• Video input: USB 3.0
• Thermocouple inputs: 4
• Dimensions: 29" x 27" x 29 in
• Power requirements: 120 VAC
• Auxillary cooling fan: Standard
• Maximum/minimum PCB size: 12" x 12 in
• Maximum/minimum component size: 2.5 x 2.5 in
• Maximum airflow: Self-containted pump 30 SLPM
• Temperature range setting: 100° to 400°C (212° - 750°F)
• Top-side heater: Inductive-convection heater, 300 Watts
• Bottom-side preheater: Medium/long wave IR, 1000 Watts