Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle, 7.85 x 6.4mm

The Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle is a specialized tool designed for the precise soldering and desoldering of Ball Grid Array (BGA) components with 48 balls. Tailored for applications in surface mount technology (SMT) and electronics manufacturing, this hot air nozzle provides targeted and controlled heat for accurate soldering and desoldering processes.

Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle Highlights:

• Specifically designed to accommodate BGA components with 48 balls, ensuring a precise fit for efficient and effective soldering or desoldering
• The BGA-48 Micro Hot Air Nozzle is designed for easy attachment and removal, streamlining the nozzle changeover process during production or rework
• The micro-sized nozzle allows for intricate work on densely populated circuit boards, enabling technicians to focus heat precisely on the BGA component without affecting nearby components
• Constructed from durable materials, this hot air nozzle is built to withstand the demands of industrial use, providing longevity and reliability in electronics manufacturing processes

Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle Specs:

• Brand: Pace
• SKU: 4028-5502
• Type: Standard
• Nozzle Style: BGA
• Product Type: Hot Air Nozzle
• Lead Free Solder Compatible: Yes