Alpha 148635 OM-338-T Lead Free No-Clean Solder Paste, SAC305, 88.5-4-M1 [500g Jar]

The ALPHA OM-338-T is a lead free solder paste designed to minimize transition concerns from tin/lead to lead free solder paste and used in a variety of applications.

Alpha 148635 OM-338-T Lead Free No-Clean Solder Paste Highlights:

• Maximizes reflow yield for lead free processing
• Excellent print consistency with high process capability
• Print speeds of up to 200mm/sec enabling fast print cycle time
• Wide reflow profile window with good solderability
• Excellent solder and flux cosmetics after reflow soldering
• Compatible with either nitrogen or air reflow
• Applications: Soldering, Desoldering
• Standards Met: IPC Class III, ROL0 IPC, Meets IPC 7095, IPC J-STD-004A,

Alpha 148635 OM-338-T Lead Free No-Clean Solder Paste Specs:

• Brand: Alpha
• SKU: 148635
• Series: OM-338-T
• Chemical Composition: Sn96.5Ag3.0Cu0.5
• Product Type: Lead-Free Solder Paste
• Physical Form: Paste
• DIN Standard 32 513, RoHS Compliant, IPC J-STD-004B
• Container Type: Jar
• Capacity: 500g
• Minimum Storage Temperature: 32
• Maximum Storage Temperature: 50
• Color: Clear
• Container Size: 500 g