Lead-Free Reflow
Soldering Ovens
Full line of flat panel and nozzle jet convection reflow ovens from Resources Unlimited Co. USA. From compact 5-zone benchtop units to 10-zone production systems, all built for lead-free and standard solder processes.
Request a Quote350°C
Max Temperature
±1°C
Temperature Accuracy
18"
Max PCB Width
5-10
Heating Zone Options
CD460-X8 / X10 Flat Panel Reflow Oven
Lead-Free 18" Wide-Body Platform
Full-size flat panel hot air convection reflow oven for single and double-sided PCB soldering. Available in 8 or 10 heating zone configurations with 2 cooling zones. The 18" (460 mm) max PCB width and 560 mm mesh belt handle full-size production boards. SMEMA compatible with dual control backup.
460 mm (18")
Max PCB Width
8 or 10
Heating Zones (Top/Bottom)
±1°C
Temperature Accuracy
42-48 kW
Power (Start)
CD460-H8 / H10 Flat Panel Reflow Oven
Lead & Lead-Free 18" Wide-Body Platform
Versatile flat panel hot air convection oven supporting both leaded and lead-free solder processes. Same 18" wide-body platform as the X series with 8 or 10 heating zones, 2 cooling zones, and 25 mm max component height. Handles BGA, CSP, and 0201 chip components with ±2°C PCB temperature deviation.
460 mm (18")
Max PCB Width
±2°C
PCB Temp Deviation
<25 min
Warm-Up Time
1,890-2,200 kg
System Weight
CD350-X8 / X10 Flat Panel Reflow Oven
Lead-Free 14" Compact Platform
Narrower-body flat panel reflow oven for 14" (350 mm) max PCB width production. Same flat panel hot air convection technology and P.I.D. control as the 460 series in a more compact footprint. Available in 8 or 10 heating zone configurations with 480 mm mesh belt width. Ideal for facilities with space constraints or smaller boards.
350 mm (14")
Max PCB Width
480 mm
Mesh Belt Width
38-45 kW
Power (Start)
1,800-2,050 kg
System Weight
CD460-V8 / V10 Nozzle Jet Reflow Oven
Lead-Free Multi-Jet Hot Air Platform
Nozzle jet hot air convection reflow oven for more precise airflow control on complex boards with mixed component sizes. The multi-jet design delivers targeted heat distribution across the PCB surface. Available in 8 or 10 heating zone configurations with 18" max PCB width and 560 mm mesh belt.
460 mm (18")
Max PCB Width
Nozzle Jet
Heating Method
48-56 kW
Power (Start)
1,980-2,250 kg
System Weight
CD-300LF-5 Five-Zone Reflow Oven
Lead-Free Compact IR Coil Platform
Compact 5-zone lead-free reflow oven using IR coil heating elements for prototyping, low-volume production, and smaller facilities. Touch screen interface, clamshell cabinet for easy maintenance, and casters for mobility. Warms up in just 15 minutes with 7 kW typical operating power on single-phase 220V.
350 mm
Mesh Belt Width
5 Zones
Independent Top/Bottom
7 kW
Operating Power
150 kg
System Weight
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Contact us for pricing, lead times, and system configurations