Automated Inspection
Equipment & Solutions
Industry-leading AOI, SPI, and process inspection systems from AOI Systems and Koh Young. Scanner-based desktop solutions through AI-powered True 3D measurement platforms for every production environment.
Request a Quote25,000+
Koh Young Systems Installed
25+
Years AOI Systems Experience
0.1 µm
Z-Axis Resolution
01005
Smallest Component Size
ScanSpection SS15000-IL
Scanner-Based In-Line Automated Optical Inspection
Fully automated inline AOI using scanner-based technology for SMT and through-hole inspection. Optical fiducial alignment maintains board-to-board accuracy, with full fault classification and SPC analysis built in. AI-enhanced defect detection available.
$32,000
System Price
01005
Smallest Component
SMT & PTH
Technology Coverage
AI Enhanced
Machine Learning
ScanSpection SS15000-PAL
Scanner-Based Desktop Automated Optical Inspection
Same high-performance scanner and software as the in-line system in a compact drawer-loading desktop format. Board placement accuracy is handled automatically through fiducial alignment, with operator training in under 30 minutes.
$22,000
System Price
01005
Smallest Component
<30 min
Operator Training
Drawer Load
Board Loading
ScanSpection SS15000-FA
Scanner-Based First Article Inspector
Automates first article inspections and production inspection without programming. Operates in Comparator mode for visual board comparison or AOI mode for algorithmic inspection. Generates comprehensive reports with fault classification and BOM comparison.
No Programming
Setup Required
2 Modes
Comparator & AOI
01005
Smallest Component
CAD Import
BOM Verification
ScanSpection SS15000-IC
Scanner-Based Desktop Image Comparator
No-programming-required inspection for low and medium volume production. Compares a known-good board against sample boards with automatic alignment. Inspects PCBs, tracks, solder balls, and non-PCB mechanical assemblies. Available as drawer or top-loader.
No Programming
Setup Required
Gold Board
Reference Method
2 Formats
Drawer & Top-Loader
SPC Ready
Defect Analysis
8030 Series & aSPIre3 SPI
True 3D Solder Paste Inspection
The industry's most trusted SPI platform using patented True 3D dual-inspection Moiré projection. The KY8030-2 delivers maximum accuracy, the KY8030-3 doubles throughput at 50.8 cm/sec, and the aSPIre3 sets metrology-level standards. The 8030 USX handles extra-long boards up to 1,800 mm. All models feature Z-Tracking warp compensation and optional auto-rework solder paste dispensing.
50.8 cm/sec
Throughput (8030-3)
True 3D
Moiré Projection
1,800 mm
Max Board (USX)
4 Models
8030-2, 8030-3, aSPIre3, USX
Zenith Series 3D AOI
True 3D Profilometric Measurement AOI
The world's best-selling True 3D AOI platform with models for every application. Zenith Alpha offers best value, Zenith UHS doubles speed for high-volume lines, Zenith 2 adds side-view cameras, Zenith F handles flexible PCBs, Zenith S inspects offline backplanes up to 650 x 600 mm, and Zenith USX covers extra-long boards up to 1,800 mm. Components up to 25 mm tall, IPC-610 compliant.
25 mm
Max Component Height
7 Models
Alpha, Zenith, UHS, 2, F, S, USX
1,800 mm
Max Board (USX)
IPC-610
Compliance Standard
Neptune Series DPI
True 3D Transparent Material Inspection
The industry's first 3D inspection solution for transparent materials using proprietary L.I.F.T. laser interferometry. Neptune T serves lab-to-industrial, Neptune C+ delivers inline DPI with thickness measurement, and Neptune USX handles extra-long boards. Detects bubbles as small as 200 µm and 100 µm splash marks.
200 µm
Bubble Detection
100 µm
Splash Mark Detection
L.I.F.T.
Laser Interferometry
4 Models
Neptune T, C, C+, USX
KY-P3 Pin Inspection
True 3D Automated Pin Inspection
Breakthrough 3D automated pin inspection for back-end quality assurance in both inline and batch configurations. Measures pins up to 20 mm with ±0.75% full-scale accuracy. Supports single pins, press-fit, fork pins, and shrouded connectors with CAD, Gerber, and ODB++ data import.
20 mm
Pin Height Measurement
±0.75%
Height Linearity
2 Configs
Inline & Batch
Industry 4.0
Integration Ready
Meister Series & ZenStar
3D Semiconductor & Mini/Micro-LED Inspection
Premium in-line 3D inspection for semiconductor packaging with 0.1 µm Z-axis resolution. Meister S/S+ inspect micro solder deposits down to 20 µm thin and 50 µm diameter. Meister D/D+ handle die and MLCC inspection including mirror-surface dies. ZenStar delivers wafer-level packaging inspection for chiplet integration, SiP, and 3D stacked architectures.
0.1 µm
Z-Axis Resolution
20 µm
Thin Solder Detection
50 µm
Micro Deposit Diameter
5 Models
S, S+, D, D+, ZenStar
KSMART & AI Solutions
Measurement-Based Process Control Platform
The central nervous system connecting all Koh Young inspection equipment. KSMART collects and distributes measurement data network-wide with real-time SPC and OEE monitoring. KPO Printer achieves 50%+ higher Cpk, KPO Mounter reduces misalignment by 18%, and KAP auto-programming uses GPU-accelerated AI for rapid program generation.
50%+
Higher Cpk (KPO Printer)
18%
Less Misalignment (KPO Mounter)
87%
Defect Root Cause Accuracy
IPC-2591
Smart Factory Certified
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