The Pace 4028-5012 BGA-421/432/736 Hot Air Nozzle is a specialized and precision tool designed for use in surface mount technology (SMT) and electronics manufacturing processes. Tailored for Ball Grid Array (BGA) packages with specific configurations (421, 432, and 736), this hot air nozzle is engineered to provide controlled and targeted heat during the soldering and desoldering of BGA components.

Pace 4028-5012 BGA-421/432/736 Hot Air Nozzle Highlights:

• Designed to accommodate BGA packages with 421, 432, and 736 configurations, ensuring a precise fit for efficient and effective soldering or desoldering
• Constructed from durable materials, this nozzle is built to withstand the demands of industrial use, offering longevity and reliability in high-temperature applications
• The BGA-421/432/736 Hot Air Nozzle is designed for easy attachment and removal, streamlining the nozzle changeover process during production or rework
• The hot air nozzle is engineered to deliver precise temperature control, enabling the focused application of heat to BGA solder joints without risking damage to nearby components

Pace 4028-5012 BGA-421/432/736 Hot Air Nozzle Specs:

• Brand: Pace
• SKU: 4028-5012
• Shape: QFP/Quad
• Size: 40.0mm x 40.0mm
• Product Type: Hot Air Nozzle
• Lead Free Solder Compatible: Yes