The Pace 4028-2503 BGA Nozzle is a specialized component designed for use with ST Rework Systems, specifically tailored for QFP132 (Quad Flat Package with 132 pins) integrated circuit packages. This precision nozzle plays a crucial role in the rework and soldering processes associated with Ball Grid Array (BGA) components, ensuring precise and controlled hot air application for effective soldering and desoldering.

Pace 4028-2503 BGA Nozzle Highlights:

• This nozzle is engineered to accommodate QFP132 BGA components, ensuring a perfect fit and efficient rework
• Built from durable materials, the BGA nozzle is designed to withstand the demands of industrial usage, providing longevity and reliability in professional settings
• The nozzle offers precise temperature control to facilitate accurate hot air application during the soldering or desoldering process
• This is crucial for preventing damage to sensitive electronic components
• The QFP132 BGA Nozzle is designed for easy attachment and removal, simplifying the process of changing nozzles during production or rework

Pace 4028-2503 BGA Nozzle Specs:

• Brand: Pace
• SKU: 4028-2503
• Type: Hot Air
• Product Type: Nozzle
• Nozzle Size: 1.06 x 1.06in
• Compatible IC Package Type: QFP-132
• For Use With: ST 300, ST 325, ST 350 Systems