The Pace 4028-2009 BGA Nozzle for ST Rework Systems is an advanced tool designed for precision soldering and rework applications, specifically tailored for Ball Grid Array (BGA) packages. This specialized nozzle is engineered to work seamlessly with ST Rework Systems, offering efficient and controlled hot air flow during the soldering and desoldering processes for BGA components.

Pace 4028-2009 BGA Nozzle Highlights:

• Tailored specifically for BGA components, ensuring a perfect fit and optimal performance during rework processes
• Designed for easy attachment and removal, facilitating quick and seamless nozzle changeovers during production or rework processes
• Crafted from durable materials to withstand the demands of industrial applications, ensuring longevity and reliability in professional settings
• The BGA nozzle is engineered for precision temperature control, allowing targeted and controlled heating of BGA components during soldering and desoldering without compromising nearby components

Pace 4028-2009 BGA Nozzle Specs:

• Brand: Pace
• SKU: 4028-2009
• Type: Hot Air
• Shape: QFP/Quad
• Product Type: Nozzle
• Compatible IC Package Type: PLCC-10