Chemtronics Chem-Wik Desoldering Braid Product Guide
Chem-Wik Desoldering Braid
As the standard desoldering braid for service and repair, Chem-Wik® Desoldering Braid ensures fast and safe desoldering. The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage. PermaPak™ Barrier Packaging ensures ultimate braid freshness and speed by sealing out harmful effects of the environment and protecting against oxidation.
Chem-Wik® Desoldering Braid:
Meets or exceeds the greatest range of perfomance standards:
- MIL-F-14256F Type R
- NASA STD-8739.3 Soldered Electrical Connections
- ANSI/IPC J STD-004, Type ROL0
Static Dissipative Packaging:
- DOD Standard 1686C and MIL-HDBK-263B
- Mil-Std-2000A
- Mil-B-81705C Static Decay Rate Provision
Chem-Wik® Rosin
The fast, safe rosin flux desoldering braid for removing solder from leads and components
Chem-Wik® RosinSD
The fast, safe rosin flux desoldering braid packaged instatic dissipative bobbins
- Coated with ultra high purity rosin
- Quickly and thoroughly removes solder
- Noncorrosive TypeR rosin flux
- Reduces the risk of damage associated with static electricity
- Coated with noncorrosive ultra high purity Type Rrosin flux
- Quickly and thoroughly removes solder
Desoldering Applications
Wire Wrap Pins
- Desolder pins for easy removal. Removes solder buildup. Eliminates potential intermittent problems.
Lugs/Posts
- Wicks solder completely, eliminating solder splash or drip. Leaves terminal fluxed and ready for resoldering.
Components
- Easily removes solder from components with straight or clinched leads. Minimum heat required. No damage to board or components.
Cleaning Applications
SMT Pads
- Quickly and safely desolders entire rows of SMT pads.
- Applications-specific sizes desolder individual fine-pitch SMT pads.
Blobs
- Eliminates and removes blobs as well as shorts and icicles. Leaves circuitry smooth. Cleans potential problem areas.
BGA Pads
- Safely removes solder from BGA pads and chips in three to four passes. Completely removes all residual solder and facilitates chip repositioning.
Finger Connectors
Cleans finger connectors and surface mount pads.
Solder Bridges
Completely removes solder bridges. Eliminates potential shorts. No damage to boards or circuitry.
Braid Sizes
BGA Purple
.030”/0.8mm White
.060/”1.5mm Yellow
.080”/2.0mm Green
.110”/2.8mm Blue
.145”/3.7mm Brown
.210”/5.3mm Red
CleanScript
Selectively retouches etched script. Improves aesthetic appearance. Eliminates secondary identification.
Easy to use.
Chemtronics Chem-Wik® ProductSelectionGuide
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Chemtronics Soder-Wick Product Selection Guide
Soder-Wick, the world's leadingbrandof desolderingbraid, is the fastest, cleanest and safest braid in the industry.
It significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Soder-Wick® Desoldering Braid optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action than any other competitive brand. Minimal flux residue on the board speeds up the cleaning process, or eliminates it entirely.
Soder-Wick DesolderingBraid isavailable in the most comprehensivevarietyof widths, lengthsand flux types.
Application-specific sizes allow for precision solder removal in a flash. Sealed in Performance Pak™ Barrier Packaging and VacuPak™ Vacuum Sealed Packaging, Soder-Wick® Desoldering Braid is completely protected from the harmful effects of the environment. The VacuPak™ vacuum-sealed can guarantees the braid to be as fast and fresh as the day it was made. The can serves as a protective storage container once the pack has been opened and is also easily
Soder-Wick Desoldering Braid meets or exceeds the greatest range of qualitative and performance standards:
- MIL-F-14256 F type R flux
- NASA-STD-8739.3 Soldered Electrical Connections
- DOD-STD-883E, Method 2022
- ANSI/IPC J STD-004, Type ROL0
Static Dissipative Packaging:
- Qualifies under MIL-STD-1686C and MIL-HDBK-263B as a non-ESD generator
- Meets the Static Decay Rate Provision of MIL-B-81705C and MIL-STD-2000A
Soder-Wick® No Clean SD:
- Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
- Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderability
- ANSI/IPC J STD-004, Type ROL0
Soder-Wick® Lead-FreeSD
The fastest, safest desoldering braid formulated specifically for use with lead-free applications
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and
Soder-Wick® Rosin
The fastest, safest rosin flux desoldering braid for removing solder from printed circuit boards
- Noncorrosive ultra high purity TypeR rosin flux
- Minimizes the risk of heat damage to the board
- Will not leave ionic contamination on the boards
Soder-Wick® Unfluxed
The unfluxed desoldering braid which can be coated with any flux type
- Can be coated with any flux type
- Allows for a constant flux type throughout the production process
- Provides quick and safe desoldering
Soder-Wick RosinSD
The fastest, safest rosin flux desoldering braid packaged in static dissipative bobbins
- Soder-Wick Rosin packaged in ESD-safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Noncorrosive ultra high purity TypeR rosin flux
- Minimizes the risk of heat damage to the board
- Will not leave ionic contamination on the boards
Soder-Wick NoCleanSD
The fastest, cleanest no-clean flux desoldering braid packaged in static dissipative bobbins
- Soder-Wick® NoClean packaged in ESD-safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Patented noncorrosive, halide free, organic no-clean flux
- Desolders up to 40% faster than competitive no-cleanbraids and leaves boards cleaner
- Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface InsulationResistance
Soder-Wick UnfluxedSD
The unfluxed desoldering braid packaged in static dissipative bobbins
- Soder-Wick Unfluxed packaged in ESD-safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Can be coated with any flux type
- Allows for a constant flux type throughout the production process
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