hello everyone and welcome to the pace in her classroom my name is Stephanie in this program we'll explore the challenging world of electronic assembly and repair today's advances in electronics depend on your ability to perform a wide variety of assembly and repair tests both safely and effectively this requires not only the right equipment but more importantly proper technique which can only be gained through training and practice remember you make the difference between success and failure in this presentation will cover the basic operation and maintenance of your pace sensitive handpiece and system for further details consult the printed manual provided with your handpiece or system a number of different techniques will be presented so be sure to use those techniques which conform to your organization's standards and finally be sure to follow all personnel safety and static control requirements before you begin to work let's get started the TT 65 thermo tweeze is one of a
family of pay sense attempt and pieces
which operate from any pace sense
attempt power source the thermo tweeze
provides safe rapid removal of a wide
variety of surface mount components in a
simple one-handed operation remove SOIC's sots PLCC's chip components and
others without damage the thermo tweeze
may also be used for realignment and
replacement of some components the
thermo tweezers low-temperature
high-capacity heating can remove even
the largest components quickly and
easily a wide selection of standard tips
meets the industry's requirements for
today's electronics new components and
applications require pace to continually
develop new techniques and capabilities
custom tips for specialized applications
are available see other pace videos for
surface mount land preparation soldering
hot jet installation and removal of
other component types in part 1 of this
presentation will discuss setup and tip
installation for your thermo tweeze
handpiece
in part to proper tip selection for
various applications will be covered in
detail part 3 deals with selecting a
proper tip temperature for your
particular application part 4 examines
handpiece tip and work preparation in
part 5 will learn basic component
removal technique for your thermo tweeze
handpiece and the safest easiest ways to
remove large components from extra-heavy
boards and in part 6 will learn
important routine maintenance for your
thermo tweeze handpiece and tips first
insert the line cord into the AC power
receptacle on the back panel of your
system then into a properly grounded AC
line receptacle the patented thermo
tweeze handpiece features an adjustable
hinge and tip gap adjustment which allow
you to achieve perfect alignment of the
tips a critical feature for safe rapid
component removal
to confirm alignment of the handpiece
turn the tip gap adjustment thumb screw
until the heaters are parallel if the
heater ends are even with each other you
can proceed with tip installation if not
loosen the hinge screw half a turn with
a tip tool then gently press both
heaters against the tip tool itself
until the heater ends are even with each
other finally tighten the hinge screw
the thermo tweeze is installed on the
front panel of your pace sense attempt
system first align the connector key
with the receptacle key way and turn its
locking ring fully counterclockwise now
insert the connector key into the power
receptacle until it stops then turn its
locking ring fully clockwise to secure
when using multiple hand pieces colored
markers are helpful to identify which
hand pieces are connected to which
channels will now review the proper
method for installing tips into your
thermo tweeze handpiece to ensure proper
fit always install tips into your thermo
tweeze when the heaters have reached an
appropriate tip temperature
setting the tip temperature will be
discussed in detail later in part two
there are three basic methods for
installing tips into your thermo tweeze
depending on their size and type to
install chip component tips insert the
tip halves all the way into the heaters
until they bottomed out next position
tip ends so they meet precisely when the
thermo tweeze handles are squeezed
together the heater set screws can be
tightened very slightly so that the tips
stay in position when being aligned then
gently tighten the heater set screws to
secure tips in place
for small PLCC tips follow the same
procedure make sure they have reached
solder melt temperature before alignment
and tightening of the heater set screws
for soj and connector tips follow a
similar procedure but first open the tip
gap further apart and squeeze the tips
against the sponge or fiber tool from
the tip maintenance station to achieve
proper spacing and alignment prior to
final tightening of the set screws the
tip tool can also be used for this
purpose
the tip should now be in alignment and
parallel when brought together for
larger PLCC tips with alignment slots
make sure that the tips are fully
inserted into the heaters then insert
the tip alignment tool into the slots
and bring the tips together like this
while continuing to hold the tips
together gently tighten the heater set
screws the tip should now be in perfect
alignment if necessary
loosen the hinge screw and readjust the
tips ends as described before the tip
gap adjustment lets you choose the
proper spacing between the tips to suit
your particular application the tip gap
must be wide enough to allow the tips to
just pass easily over the component but
narrow enough to avoid contact with
adjacent components the proper tip gap
adjustment provides maximum convenience
and safety especially on high density
circuit boards next in part 2 we'll
learn how to select the proper tip for
your particular application
a wide variety of standard and custom
thermo tweeze tips are available to suit
many different surface mount removal
applications there are two-sided tips
for chip components SOI CS s O'Jays and
others there are four-sided tips to
remove jail eaded PLCC components PQ fps
and leadless ceramic chip components or
LCCC's there are also special thin
walled tips for leadless components
found on micro miniature pager boards
and other high density assemblies tips
are also available for removal of extra
large extended lead devices such as this
304 lead pqfp these tips let you remove
the tiniest chip components safely for
further details on available tips
consult the latest revision of the pace
tip and temperature selection system or
the pace price and parts books to select
the precise tip for your application
match the component you want to remove
with the appropriate drawing found in
the thermo tweeze section of the tip and
temperature selection system then follow
the chart to the right and select the
lead count or tip dimensions which match
the specifications of the component
finally note the corresponding pace part
number of the tip for your application
and install it in the thermo tweeze as
described in part 1
you may verify the approximate match of
the tips to the component while cold but
tinning on the tips or component may
affect the fit proper fit of the tips to
the component is best verified during
operation when the tips are heated to
operating temperature and the tinning is
molten the heated tip should pass easily
over the body of the component and
contact all the leads at once when the
tips are brought together make certain
the hot tin tips contact all the leads
at the same time and be sure your
component identification and tip
selection are correct as tolerances and
specifications of components can vary
greatly proper tip selection is vital
for safe component removal you can often
compensate for minor sizing differences
by using the bridge fill method
described later in part 4 otherwise a
custom tip may be required if you have
any questions regarding applications
please contact pace or your local
authorized pace representative next in
part 3 we'll learn how to select an
appropriate tip temperature for your
particular application
the Tiffin temperature selection system
is a convenient reference for choosing a
temperature for your application and
provides other important information
setting and maintaining a proper tip
temperature is essential for safe
effective operation of your thermo
tweeze handpiece to set tip temperature
first turn the power on if your system
has an installed password it must be
entered first the password will consist
of a combination of keystrokes before
setting tip temperature first note the
channel powering your thermo tweeze then
press the channel select key until the
LED for the channel powering your
handpiece illuminates to set tip
temperature press the tip set key and
immediately enter your desired tip
temperature using the scroll keys on
single channel digital display systems
follow a similar procedure on cents
attempt systems with a dial display
simply adjust the control knob for the
channel powering your thermo tweeze to
your desired tip temperature as with any
heating system large surface mount tips
lose heat much more quickly than smaller
tips causing the true tip temperature to
be much lower than the set temperature
this difference in temperature is called
tip temperature offset pay sensitive
systems with digital displays feature
Auto tip temperature offset compensation
which lets you set and display honest
accurate temperatures for any size and
type of tip
to assure the most accurate tip
temperature turn to the thermo tweeze
section of the tip and temperature
selection system and identify the tip
installed in the handpiece for digital
display systems enter the tip offset
constant which corresponds to the
installed tip by first pressing the tip
offset key then the scroll Keys until
the correct value appears in the display
now press the set key and enter your
desired tip temperature the true tip
temperature will appear in the display
for dial display systems select a true
tip temperature then adjust the control
knob to the corresponding dial setting
for more specific information on setting
the tip temperature consult the
introduction of the tip and temperature
selection system or your handpiece
manual
the thermo tweeze handpiece is designed
to operate efficiently at safer lower
tip temperatures for most surface mount
removal applications use the lowest tip
temperature which will provide rapid yet
controllable melt of all the solder
joints to increase tip life and reduce
the possibility of damage begin with a
tip temperature of 315 degrees Celsius
or 600 degrees Fahrenheit adjust
temperature as necessary to suit your
particular application on extra-heavy
multi-layer boards or boards with ground
planes it may be necessary to increase
the tip temperature to achieve rapid
complete solder melt of all the joints
however true tip temperatures over 400
degrees Celsius or 750 degrees
Fahrenheit can greatly increase the risk
of damage remember to always follow your
organization's tip temperature
guidelines for each particular
application surface mount removal on
extra-heavy boards will be discussed
later in part 5 next in part 4 will
learn about handpiece tip and work
preparation
when working on static sensitive boards
be sure to follow all requirements of
your organization's z/os ESD control
program before proceeding the first step
is to examine the board and components
to be removed for any signs of conformal
coatings heavy oxides or contamination
which can greatly interfere with heat
transfer into the solder joints during
removal using a pace Micra Sheen system
or other appropriate means remove
conformal coatings before attempting to
remove any component see other pace
videos for more detail on removal of
conformal coatings a cleaner approved by
your organization may be used to remove
heavy contamination and oxides an
approved flux may also be used to break
down surface oxides and aid heat
transfer it is also important that the
board is free of excess moisture before
attempting component removal if
necessary
gently dry the board by using a pace
mini thermo jet handpiece at a low
temperature or by other appropriate
means
clean properly tin tips are essential
for maximum transfer of heat to the
solder joints during reflow and removal
of a surface mount component after the
tips have reached a proper operating
temperature clean them with the fiber
tool to remove old solder then use the
sponge tool to remove any remaining
oxides finally tin the inside surfaces
with an approved flux core solder if the
tips don't wet with solder repeat the
cleaning process and tin again if tips
still don't accept solder the problem
may be with the particular type of flux
in the solder you're using try a special
tip reconditioning process if approved
by your organization once the tips are
properly tinned adjust the tip gap
thumbscrew so the tips are just wide
enough to fit easily over the component
for safe rapid removal it is essential
that the tips make good contact with all
the leads at once to ensure uniform
solder joint reflow to further improve
heat transfer or thermal linkage with
all the leads there are three distinct
methods these include applying flux
using a solder bridge fill or using a
solder preform in most cases applying an
approved liquid flux or paste flux is
sufficient in cases where the tip is not
making sufficient thermal linkage with
all the leads at once the solder bridge
fill method is the safest most effective
means of improving heat transfer and can
greatly speed up the removal process
solder bridge fill is the preferred
method with large extended lead devices
such as this 208 lead pqfp using a
heated soldering or d soldering tip and
large gauge flux core solder approved by
your organization apply solder across
all the joints like this until every
component lead is bridged together with
solder then proceed with removal solder
bridging assures rapid even heating of
all the joints at once virtually
eliminating the risk of damage the third
method of improving thermal linkage is
to use a solder preform with large gauge
flux core solder form a loop tightly
around the component to be removed then
trim off excess applying additional
external flux will further aid heat
transfer before proceeding with removal
it may be necessary to open the tip gap
adjustment so that the tips pass over
the solder preform before grasping the
component it is also possible to use
solder paste to improve heat transfer
during component removal however use
extreme caution because solder balls may
be produced which could cause short
circuits if not thoroughly cleaned off
the board next in part 5 will learn
basic technique for removing components
with the thermo tweeze handpiece
in parts one through four we covered
setup tip selection and installation
setting tip temperature and preparation
of the work handpiece and tips now we're
ready to remove a component to begin
bring the handpiece and tips straight
down over the components staying at
right angles to the board then gently
squeeze the tips together making good
contact with all the leads avoid
contacting the component body substrate
or adjacent components if necessary
readjust the tip gap the goal is to
evenly heat all the solder joints to
reflow in a rapid yet controlled fashion
before lifting the component complete
solder melt of all the joints can be
observed visually or by the component
yielding to a very slight movement never
apply force or lift the component before
complete reflow otherwise you may cause
damage when all of the joints have
refloat the component can be lifted off
easily move the handpiece over a burn
proof surface and release the component
follow this same method for all other
four sided and two sided components
if you don't get rapid complete reflow
of all the solder joints in about three
to five seconds remove tips rotate 90
degrees and try again
this technique helps evenly distribute
heat when very high thermal mass joints
are present if you still don't achieve
complete solder melt quickly remove the
tips and try one of the methods
described in part 4 for improving
thermal linkage with the component leads
you may also increase the tip
temperature to within your
organization's guidelines or maximum
safety limits for extra heavy boards
with ground or voltage planes or on
ceramic or polyamide assemblies
preheating the assembly using a pace hot
spot set it approximately 100 degrees
Celsius or 212 degrees Fahrenheit will
greatly speed up the removal if you are
still having difficulties check to see
if there is a conformal coating on the
board interfering with heat transfer
during reflow or an adhesive underneath
the component preventing removal after
reflow review part 4 and other paste
videos for conformal coating removal
methods for components bonded with
adhesives use the bridge fill method
when all the joints have refloat use
curved tweezers to pry up a corner of
the component after removing a component
contamination left on the lands and old
solder should be removed before
replacement of a new component see other
pay's videos for safe effective methods
on removing old solder from surface
mount lands next in part 6
we'll learn important regular
maintenance for your thermo tweeze
handpiece
during the workday always keep your tips
clean and tinned with fresh solder
especially before placing the thermo
tweeze in its cubby tip should be
examined periodically for wear and their
ability to be tinned with solder worn or
damaged tips or tips that won't hold
solder after repeated attempts to clean
Reeth in or recondition should be
replaced to maintain optimum heat
transfer and proper tip grounding
periodically remove the tips and clean
the heater bores with the supplied 3/16
inch wire brush while the heaters are
hot when work is over
remove your cleaned tin tips and store
them in their ready racks place the
thermo tweeze into its cubby and turn
off the power there is an endless
variety of other applications you can
perform with the thermo tweeze handpiece
and paces the extensive selection of
standard and custom tips for other
assembly and repair applications such as
surface mount land preparation
through-hole soldering desoldering surface mount installation and removal of others surface mount components therem are a wide range of sensitive hand pieces and techniques which are presented in other programs of the sense attempt systems video manual series if you have any further questions on a particular assembly or a repair problem feel free to contact us or your local representative our product applications and training departments are happy to help on behalf of all of us here at pace we'd like to thank you for joining us and look forward to seeing you again soon in the pace center classroom