The MT-200 mini tweeze handpiece provides safe, rapid removal of a wide variety of surface Mount components in a simple one handed operation, Including the smallest chip components on very densely populated boards, such as 0201's and even 01005's. Install power cord into rear of unit. Then plug into power strip receptacle connect the MT-200 to the front of the ADS200 install instant setback or ISB cable into the ISB port on the back of the ADS200, the ISB or the instant setback cubby automatically reduces tip temperature to below solder melting point extending tip life for further information on setup and use consult the operation manual. Using the tip tool, insert tips all the way into the handpiece. You can also use the hot grip removal pad. Use the tip gap adjustment wheel to bring the tips closer together during alignment, Then use the tip rotational adjustment to align tips If necessary, simply pull one tip slightly out for Z access alignment. Now the tip pairs are perfectly aligned to each other. The procedure is the same for all fine point chip and smaller SOT removal tips, Alignment of larger tips for SOICs, TSOPs and connectors is slightly different in that the tip pairs do not meet, but instead should be aligned with the component to be removed.
It's important to choose the right tip for the job, Match the size and type of tips to the component you want to remove For SOIC, TSOP and connector removal. Choose the appropriate size tip, which is just long enough to contact. And reflow all the leads at once SOIC and other multiple lead tips will not meet, but can be fitted over the component to confirm the tips are aligned and parallel to each other. As a general rule to maximize heat transfer, select the shortest widest tip with which you can safely access the work. Use this tip on small chip components where there is sufficient space to safely access the component. However, for tightly spaced or hard to reach components longer, thinner tips are the best choice. These tips are even thinner and maybe the best choice when the component two component spacing is extremely tight as found on advanced cell phone boards, Power unit on and use the red up and the blue down buttons to enter the desired set temperature. You can also press the round black button to scroll through the three preset temperatures for most applications. Start with a tip temperature of 650F or 350C and adjust as necessary in accordance with your organization's requirements.
Although counterintuitive, it is better to use a lower tip temperature, particularly with fine point tips to reduce oxidation and improve heat transfer. When using the mini tweeze handpiece, adjust the tip gap just wider than the component to ease, targeting, and reduce operator fatigue, application of a compatible liquid flux or gel flux to component joints will help break down oxides and aid heat transferred during removal. Next gently clean the tips with the damp sponge Or an available sponge cleaning tool to remove oxides. If heavy oxides and residues are present first gently used a brass wool or available fiber cleaning tool to remove them followed by the damp sponge just prior to removal tin, the tips with fresh solder to minimize buildup of new oxides and aid heat transfer. Now you are ready to proceed with component removal. Use the same procedure for other tip geometries Preheating, even on smaller boards allows the use of lower tip temperatures and will yield faster, safer, and more reliable results on very heavy boards with large ground planes or heat sinks, preheating of the board is critical to achieving safe rapid refloat during rework. Once the component is removed, prepare the lands for installation of the replacement component.
This can be performed using a flow to soldering technique with the solder extractor
Or with a solder wicking technique. Finally clean flux residue from the lands. Now we're ready to install the new component. Pace offers a wide variety of simple cost-effective soldering and rework solutions. Visit us today at paceworldwide.com.