Techspray 1978-DP Silicone-Free Heat Sink Compound [4oz]
$42.24
Availability: In stock
SKU
TSP1978-DP
The Techspray 1978-DP is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink.
| Manufacturer | TECHSPRAY |
|---|---|
| Manufacturer Part Number | 1978-DP |
| Technimark SKU | TSP1978-DP |
| Volume | 4 OZ |
Techspray 1978-DP Silicone-Free Heat Sink Compound [4oz]
The Techspray 1978-DP is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
Techspray 1978-DP Silicone-Free Heat Sink Compound Highlights:
- Container Size 1lb
- Container Type Jar
- Chemical Composition Zinc Oxide
- In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink
- For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required
- Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects
Techspray 1978-DP Silicone-Free Heat Sink Compound Specs:
| Manufacturer | TECHSPRAY |
|---|---|
| Manufacturer Part Number | 1978-DP |
| Technimark SKU | TSP1978-DP |
| Volume | 4 OZ |
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