The Techspray 1978-1 is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.

Techspray 1978-1 Silicone-Free Heat Sink Compound Highlights:

• Series 1978
• In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink
• Electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required
• Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects

Techspray 1978-1 Silicone-Free Heat Sink Compound Specs:

• Brand: Techspray
• SKU: 1978-1
• Color: Gray
• Product Type: Heat Sink Compound
• Minimum Operating Temperature: -40°F
• Maximum Operating Temperature: +392°F
• View our Techspray SDS Sheets Here