Techspray 1978-1 Silicone-Free Heat Sink Compound [1lb Jar]
$92.42
Availability: Available to Order
SKU
TSP1978-1
The Techspray 1978-1 is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink.
| Manufacturer | TECHSPRAY |
|---|---|
| Manufacturer Part Number | 1978-1 |
| Technimark SKU | TSP1978-1 |
| container capacity | 1 LB |
Techspray 1978-1 Silicone-Free Heat Sink Compound [1lb Jar]
The Techspray 1978-1 is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
Techspray 1978-1 Silicone-Free Heat Sink Compound Highlights:
- Series 1978
- In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink
- Electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required
- Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects
Techspray 1978-1 Silicone-Free Heat Sink Compound Specs:
| Manufacturer | TECHSPRAY |
|---|---|
| Manufacturer Part Number | 1978-1 |
| Technimark SKU | TSP1978-1 |
| container capacity | 1 LB |
Write Your Own Review
