Panasonic Connect

Electronics Assembly Manufacturing Equipment

Complete SMT line solutions for any mix, any volume. From high-speed placement and screen printing to odd-form insertion, microelectronics bonding, and nanometer-precision metrology.

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50,000+

CPH Placement Speed

±15µm

Placement Accuracy

±3.8µm

Print Accuracy

0.01µm

Metrology Resolution

NPM-GH Autonomous Labor Saving Machine

G-Series Pick & Place

The first machine in Panasonic's new G-Series, the NPM-GH maximizes output using three newly designed heads. Built for autonomous factory operation with predictive maintenance, real-time monitoring, and remote error recovery.

50,000+ cph

Placement Speed

±15 µm

Standard Accuracy

±10 µm

Ultra-Precise Option

975 x 2473 mm

Machine Footprint

Auto Setting Feeder (ASF) automates component supply
Remote error recovery for reduced floor monitoring
Real-time unit condition monitoring
Predictive maintenance before condition deterioration
Shorter spindle strokes reduce vibration
Three newly designed placement heads

NPM-GP/L Next-Generation Printer

G-Series Screen Printer

The newest screen printer in the NPM-G Series, delivering world-class solder paste printing performance. Features automatic solder retrieval, real-time APC-5M monitoring, and M2M integration with inspection equipment to reduce defect losses.

±3.8 µm

Printing Accuracy

12 sec

Cycle Time

510 x 510 mm

Max PCB Size

736 x 736 mm

Screen Frame

Automatic on-mask solder retrieval after printing
APC-5M real-time paste monitoring
M2M integration with solder inspection equipment
Optional fully automatic printing process
Automated model changeover during production
5M change response for stable print quality

NPM-VF Odd-Form Component Insertion Machine

Versatile Insertion Platform

High-speed through-hole and odd-form component insertion with an active under-board clinch system. Flexible feeder configurations support tray, stick, radial, axial tape, and bowl feeders for maximum versatility.

4,500 cph

Insertion Speed

100 N

Max Push Force

510 x 460 mm

Max PCB Size

200 g

Max Component Weight

Active under-board clinch traverses population area
Components up to 130 x 35 x 60 mm
Cut & clinch with 100-150N insertion force
Tray, stick, radial, axial & bowl feeders
Clinch pitch 2.5 to 40 mm
Lead diameter 0.4 to 1.0 mm (soft copper)

MD-P300 Flip Chip Bonder

Multi-Process Bonding System

Combines flip chip, thermosonic, and thermocompression bonding in a single compact footprint. Supports 300 mm wafer substrates for CMOS image sensors, processors, MEMS, and power device assembly.

±5 µm

Placement Accuracy

5,500 cph

Production Output

300 mm (12")

Wafer Support

0.5 sec

Cycle Time (Dry)

Thermosonic, C4, and TCB bonding processes
Head heating up to 300°C, substrate up to 200°C
Post-bonding inspection via stage camera
In-line compatible with Panasonic SMT machines
COB hybrid assembly capability
CMOS, MEMS, and power device applications

UA3P 3D Profilometer

Ultra-High Accuracy Measurement System

Combines AFM-level accuracy with CMM measurement range using atomic force probe technology and HeNe laser interferometric positioning. Built on a solid granite base for factory-floor deployment with 0.1 µm total uncertainty.

0.01 µm

Max Accuracy

0.3 nm

Axis Resolution

200 x 200 mm

Measurement Range

0.15 mN

Measuring Force

HeNe frequency-stabilized laser interferometry
Atomic force probe stylus technology
Diamond stylus, 30° tip angle, 2 µm radius
Aspheric lenses, wafers & free-form surfaces
Granite base for factory-floor stability
UA3P-300, UA3P-4 & UA3P-5 models available

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