The IR 3100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.

Pace 8007-0586 IR3100 Infrared BGA Rework Station Highlights:

• Ultra-High Precision Placement Capability
• High Sensitivity Vacuum Pick
• Sodr-Cam Reflow Camera
• Height Adjustable Bottom-Side Preheater
• High-Definition Optical Alignment System
• Quad-Field Imaging for Large/Fine Pitch BGA's
• Integrated Board Support Wand

Pace 8007-0586 IR3100 Infrared BGA Rework Station Specs:

• Brand: Pace
• SKU: 8007-0586
• Product Type: BGA Rework Station
• Power Distribution Graph
• Dimensions: 737mm (29") H x 686mm (27") W x 737mm (29") D
• Power Requirements: 120 VAC, 50/60 Hz (1550 Watts maximum) || 230 VAC, 50 Hz (1550 Watts maximum)