The Pace 4028-5010 BGA-18 Hot Air Nozzle is a specialized tool designed for precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. This hot air nozzle is engineered to deliver targeted heat application to the specific areas of BGA packages, ensuring reliable soldering connections without damaging surrounding components. Pace offers a wide variety of QuickFit nozzles for different component types. Each nozzle connects to the Nozzle Adapter included with each TF200, TF500, TF700.

Pace 4028-5010 BGA-18 Hot Air Nozzle Highlights:

• Tailored for BGA components, the nozzle is designed to accommodate BGA-18 packages, offering a precise fit for effective soldering and desoldering
• Crafted from high-quality materials, this hot air nozzle is built to withstand the demands of professional electronics manufacturing and repair, providing durability and long-lasting performance
• The nozzle is engineered to provide precise temperature control, allowing for accurate and controlled application of heat to BGA solder joints. This helps prevent thermal damage to sensitive electronic components
• The design of the nozzle ensures uniform heat distribution, facilitating the soldering or desoldering process and minimizing the risk of overheating or uneven solder joints
• The BGA-18 Hot Air Nozzle is designed for easy attachment and removal, simplifying the process of changing nozzles during production or rework

Pace 4028-5010 BGA-18 Hot Air Nozzle Specs:

• Brand: Pace
• SKU: 4028-5010
• Length: 0.35 in
• Type: Standard
• Nozzle Style: BGA
• For Use With: ST 300, ST
•  325 and ST 350 Systems
• Product Type: Hot Air Nozzle
• Lead Free Solder Compatible: Yes