The Pace 4028-5002 BGA-169/168 BGA Hot Air Nozzle is a specialized tool designed for precise and effective soldering and desoldering applications in the realm of surface mount technology (SMT) and electronics manufacturing. This nozzle is specifically engineered to accommodate Ball Grid Array (BGA) packages with 169 or 168 solder balls, providing a targeted and controlled hot air flow for rework and assembly processes. Pace offers a wide variety of QuickFit nozzles for different component types. Each nozzle connects to the Nozzle Adapter included with each TF200, TF500, TF700.

Pace 4028-5002 BGA-169/168 BGA Hot Air Nozzle Highlights:

• Tailored to fit BGA packages with 169 or 168 solder balls, ensuring a secure and precise fit for soldering and desoldering operations
• Crafted from high-quality materials, this hot air nozzle is built to withstand the demands of industrial use, delivering durability and reliability over time
• Featuring a user-friendly design, the BGA-169/168 BGA Hot Air Nozzle is easy to attach and detach, facilitating quick and convenient changes during production or rework
• The nozzle is designed to provide accurate temperature control, enabling precise application of heat during soldering or desoldering without risking damage to nearby components

Pace 4028-5002 BGA-169/168 BGA Hot Air Nozzle Specs:

• Brand: Pace
• SKU: 4028-5002
• Type: Hot Air
• Product Type: Nozzle
• Nozzle Size: 23.0mm x 23.0mm
• Compatible IC Package Type: BGA-169/168