The Pace 4028-2508 BGA Nozzle is a specialized tool designed for use in surface mount technology (SMT) and electronics rework processes, particularly for Ball Grid Array (BGA) components. This specific nozzle, designated for ST Rework Systems and carrying the BQF84 classification, is engineered to provide precision and efficiency in the rework of electronic components with BGA packaging.

Pace 4028-2508 BGA Nozzle for ST Rework Systems Highlights:

• Tailored to accommodate Ball Grid Array (BGA) components, specifically designed for use with the ST Rework Systems, ensuring a precise fit for efficient and effective rework processes
• Constructed from durable materials, this nozzle is designed to withstand the demands of industrial use, providing longevity and reliability in electronic rework applications
• The nozzle is engineered to deliver precise and controlled hot air flow, essential for accurately reworking BGA components without causing damage to surrounding parts
• The BGA Nozzle is designed for straightforward attachment and removal, simplifying the process of changing nozzles during rework operations

Pace 4028-2508 BGA Nozzle for ST Rework Systems Specs:

• Brand: Pace
• SKU: 4028-2508
• Type: Hot Air
• Product Type: Nozzle
• Nozzle Size: 0.8 x 0.8in
• Compatible IC Package Type: BQFP
• For Use With: ST 300, ST 325, ST 350 Systems