Featuring a durable construction, the BGA Nozzle is crafted to meet the high standards of Pace's rework equipment. The nozzle is engineered to accurately target and direct hot air during the reflow process, ensuring precise and controlled heating for the removal or replacement of PLCC44 ICs on circuit boards. The specific design of the nozzle is optimized to match the dimensions and configuration of PLCC44 packages, facilitating efficient and effective rework operations.

Pace 4028-2005 BGA Nozzle Highlights:

• Specifically designed for ST Rework Systems, ensuring optimal performance and compatibility
• Precision-engineered BGA (Ball Grid Array) nozzle for effective and efficient rework processes
• Tailored for PLCC44 (Plastic Leaded Chip Carrier with 44 pins) components, making it versatile for various electronic devices
• Crafted with durable materials to withstand the rigors of rework processes, ensuring longevity and reliability
• The nozzle's design allows for precise and controlled application of heat during rework, minimizing the risk of damage to components
• Designed for user-friendly installation, facilitating quick setup and minimizing downtime during rework procedures

Pace 4028-2005 BGA Nozzle Specs:

• Brand: Pace
• SKU: 4028-2005
• Type: Hot Air
• Product Type: Nozzle
• Nozzle Size: 0.7 x 0.7 in
• Lead Free Solder Compatible: Yes
• Compatible IC Package Type: PLCC-44
• For Use With: ST 300, ST 325, ST 350 Systems