The Pace 4028-2004 BGA Nozzle is a specialized component designed for use with ST Rework Systems, specifically catering to PLCC32 (Plastic Leaded Chip Carrier with 32 pins) integrated circuits. This precision tool is crucial in the field of electronics manufacturing and repair, where the removal and replacement of Ball Grid Array (BGA) components demand a high level of accuracy and efficiency.

Pace 4028-2004 BGA Nozzle Highlights:

• Specifically designed for ST Rework Systems, this BGA nozzle is a precision tool engineered for reliable and efficient performance
• The BGA nozzle is tailored to work seamlessly with PLCC32 components, ensuring a precise fit and optimal rework results
• With dimensions measuring 12.8mm x 15.3mm, this BGA nozzle provides the right size and coverage for accurate rework on targeted components
• Crafted with durable materials, the Pace 4028-2004 BGA Nozzle is built to withstand the rigors of rework processes, providing longevity and consistent performance

Pace 4028-2004 BGA Nozzle Specs:

• Brand: Pace
• SKU: 4028-2004
• Product Type: Nozzle
• Type: Hot Air
• Nozzle Size: 0.5 x 0.61in
• Compatible IC Package Type: PLCC-32
• For Use With: ST 300, ST 325, ST 350 Systems