The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

Alpha 129736-0005 NR-330 VOC-Free No-Clean Solder Flux Highlights:

• Bellcore compliant for assemblies requiring this standard,
• VOC-free to help meet air quality regulations,
• Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
• Thermally stable activators provide low solder bridging,
• Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
• Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
• Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Alpha 129736-0005 NR-330 VOC-Free No-Clean Solder Flux Specs:

• Brand: Alpha
• SKU: 129736-0005
• Product Type: No-Clean Flux
• Physical Form: Liquid
• Chemical Composition: Rosin; 99.3sn/0.7cu and 96.5sn/3.5ag
• Applications: Soldering
• Container Type: Pail
• Capacity: 5gal
• Length: 16.5 in
• Width: 14.65 in
• Height: 10.7 in
• Color: Clear Colorless
• Container Size: 5 gal
• Maximum Storage Temperature: 110
• Minimum Storage Temperature: 50, 77
• Specific Gravity: 1.013