Alpha EF-8300 is a rosin-containing, alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high-density PCBs in both Lead-free (standard SAC and Low Ag SAC alloys) and eutectic tin/lead processes. It is designed to have low bridging n bottom side QFPs, as well as provide superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.

Alpha 152420-0005 EF-8300LR No-Clean Soldering Flux Highlights:

• Exhibits exceptional electrical reliability for a low-solids wave soldering flux.
• Complies with IPC-J-STD-004 SIR, Bellcore SIR, Bellcore ECM, JIS ECM, and JIS SIR,
• Thermally stable activators provide minimized solder bridging in a low-solids, no-clean flux for wave soldering and Selective Soldering in lead-free and tin-lead applications,
• Reduces the surface tension between solder mask and solder to resist solder ball formation,
• Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue,
• IPC-J-STD-004 Classification - ORL0
• Good hole-fill demonstrated by >96% yield on 10 mil holes.
• Low bridging performance on connectors.
• Good micro-solder ball performance in Lead-Free applications
• Pin testable
• Specifically designed for use on Cu-OSP PCBs
• Excellent Lead-Free soldering performance on various board finishes.
• Evenly spread, tack free residue.
• Capable for high density as well as general purpose Lead-Free soldering processes.
• Can be used in Pb free or Sn/Pb processes

Alpha 152420-0005 EF-8300LR No-Clean Soldering Flux Specs:

• Brand: Alpha
• SKU: 152420-0005
• Series: EF-8300LR
• Product Type: Wave Soldering Flux
• Physical Form: Liquid
• Chemical Composition: Alcohol
• Applications: Lead-Free and Tin-Lead Soldering
• Container Type: Pail