Chemtronics CW2400 Epoxy Conductive Adhesive & Hardener [7 Grams]

The CircuitWorks CW2400 is a light gray, epoxy adhesive that comes in a 0.25 oz syringe. The high temperature resistant epoxy is designed to protect electronic circuits and components from corrosion, moisture, oxidation, abrasion, and thermal shock. Bonds to solder alloys, aluminum, alumina, glass, copper, epoxy laminates and many plastics. Fully cured bond has a lap shear strength of >882 lbs. and a shore hardness of >70. Easy mix ratio of 1 to 1 (8-10 minute pot life). Cures in 5-10 minutes at 150°F. Room temperature cured at or above 75°F (25°C) in 4 hours. Kit includes 0.25 oz. epoxy, reusable applicator and instructions.

Chemtronics CW2400 Epoxy Conductive Adhesive & Hardener Highlights:

• Product Type: Epoxy Adhesive
• Conductive silver epoxy provides excellent electrical conductivity
• High strength conductive bond
• Mixed material provides five minute work time, fast cure
• Repairs defective traces and creates jumpers on boards
• Quick solderless electronic connections
• Chemical Composition: Part A:Silver, Reaction Product:Bisphenol-A-(Epichlorhydrin), Epoxy Resin; Part B:Silver, 3,6-Diazaoctanethylenediamin
• Applications: Conductive Bonds Between Heat Sensitive Components, Solderless Surface Mount Connections, Circuit Board Trace Repair, Static Discharge and Grounding, Solder Repair, Conductive Structural Adhesions

Applications:

• Repairs traces and temperature sensitive circuits
• Makes high‑strength solderless conductive connections

Chemtronics CW2400 Epoxy Conductive Adhesive & Hardener Specs:

• Brand: Chemtronics
• SKU: CW2400
• ESD-Safe: Yes
• Series: CW
• Hardness: >70Shore D
• Color: Part A:Light Gray; Part B:Sliver/Gray
• Cure Time: 4h
• Length: 8.5 in
• Specific Gravity: 4
• Width: 5.0 in
• Height: 1.0 in
• Cure Type: Room 77°F
• Gel Time: 8 to 10min
• Maximum Operating Temperature: +212°F
• Minimum Operating Temperature: -131°F
• Container Capacity: 0.25oz
• Container Type: Syringe
• Storage Conditions: COOL DRY PLACE
• Physical Form: Part A:Solid/Paste; Part B:Liquid/Paste