Pace TF1800
BGA/SMD Rework System
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Solutions and systems for soldering, rework and repair of electronics
Introducing the TF1800 BGA/SMD Rework System.
Inductive-Convection Heating Technology
• Ultimate Process Control
• Advanced Thermal Performance
• Unsurpassed Productivity
• Outstanding Energy Efficiency
Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA and SMD components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.
Enter PACE’s TF 1800 BGA/SMD Rework System...With its groundbreaking, patent-pending Inductive-Convection Heating Tech- nology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.
Top-Side Heater: Fast Heat Up—Rapid Cool Down
350°C 
SECONDS
TF1800 Conventional Forced Air Convection Heater
PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 1800 immediately drops to temperatures well below solder melt when the heater is de-energized.
| Inductive-Convection Heater pre-heats the air in a cyclonic fashion around the induction coil before it enters the inner chamber. |  |
| Cross Section of Heater: After entering the inner chamber, the pre-heated air is instantly heated to target temperature. |  |
How It Works
The TF 1800’s Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work. The air is first pre-heated in the outer chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber. It’s then heated to target temperature through a highly efficient heat transfer process in an energized induction field. During active cooling, the induction coil is de-energized. The heater’s unique low thermal mass design further enhances the system’s ability to heat up and cool down quickly and gives the operator an unsurpassed level of process control in developing thermal profiles for the particular rework task at hand.
Active Cooling Yields High Quality Solder Joints
After solder joint reflow is complete, the TF 1800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.
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Cross Section of Heater: Low thermal mass Inductive Convection Heater allows air to instantly cool down below solder melt temperatures. Powerful, Energy Efficient Performance |
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Revolutionary Inductive Convection Heater
Patent-Pending low thermal mass heater provides quick response heat-up and cooldown, resulting in faster throughput, requiring far less power to operate.
Ultra-Precise Placement Capability
Motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeat able movement with no drift, allowing for soft landing of components and 28μm (.0011") placement accuracy.
Single Axis Operation
All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating the risk of component movement after placement and reflow.
Advanced, User-Friendly Software
4th generation software guides operators through an intuitive interface that virtually automates the process—so advanced that creating profiles has never been easier!
TF 1800
Active Cooling provides Rapid Solder Cooldown
Inductive-Convection heater offers swift yet controlled component/PCB cooling, directly through the nozzle, yielding the highest quality joints.
High-Definition Vision Overlay System with Quad-Field Imaging
The automatically controlled, retractable optical alignment system features a 1080p Hi-Def camera, simultaneous viewing of PCB pads/component balls (via beam-splitting dichroic prism), shadow-free LED lighting, up to 240x zoom capability and Quad-Field Image technology (comes standard) for finest pitch or very large components.
4 Thermocouple Inputs
Ensures accurate/precise profile development and provides real-time PCB monitoring.
Bottom-Side Preheater Adjustable Height
Medium/long wave quartz IR heating elements respond faster with 1000 W of power. The preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.
Precision Board Holder
PCB Holder features fine micrometer adjustments for the most delicate X and Y alignment (theta control on reflow head). Extruded Board Holder Arms with T-Slots and movable clamps offer support for even the most irregularly shaped boards with unusual edges.
Board Support Wand
Adjusts easily and prevents warping of PCB during reflow.
Advanced Features
| Ultra-High Precision Placement |
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| Newly designed reflow head provides smooth, precise movement with no drift, allowing for repeatable and accurate placement. |
| ACE Exclusive Height Adjustable Bottom-Side Preheater |
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| High powered quartz IR Preheater allows for fast, efficient bottom-side heating and is height adjustable to provide more aggressive thermal transfer on higher mass PCBs. |
| High-Definition Optical Alignment System |
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| An automated Vision Overlay System uses a dichroic beam-splitting prism, high intensity LEDs, and new high definition 1080p camera to easily align any component. |
| Quad-Field Imaging for Large/Fine Pitch BGAs |
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| Quad-Field Imaging allows up to four corners of a large component (and its pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs. |
| High Sensitivity Vacuum Pick Assembly |
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| New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. |
| Integrated Board Support Wand |
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| An innovative Board Support Wand adjusts easily, prevents warping during reflow, and is easily removed when not in use. |
| Crisp & Clear Images for Component Alignment |
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| A high definition Vision Overlay System uses bright white LEDs with independent intensity control to provide precise distinction of pads and solder ball or leads. |
| Fourth Generation Software Suite |
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| Newly designed Windows-based software provides a simple graphical interface with intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more. |
TF1800 Specifications
| Part Numbers | 8007-0574 (120 VAC Unit) | 8007-0575 (230 VAC Unit) |
| Power Requirements |
120 VAC, 50/60 Hz (1600 Watts maximum). Requires dedicated 20 A supply. |
230 VAC, 50 Hz (1600 Watts maximum). Requires dedicated 10 A supply. |
| Dimensions | 737mm (29") H x 686mm (27") W x 737mm (29") D |
| Weight (Without Computer) | 45kg (100lbs) |
| Top-side Heater | Inductive-Convection Heater, 300 Watts |
| Bottom-side Preheater with Adjustable Working Height |
Medium/Long wave IR, 1000 Watts; 220mm (8.6") x 155mm (6.1"); Adjustable working height from lowest position up to 38mm (1.5") closer to the PCB |
| Active Cooling Capability | Standard, offers swift, yet controlled component/PCB cooling, directly through the nozzle |
| High Sensitivity Vacuum Pick |
Pick is counterweight balanced, and utilizes an optical sensor and precision high temperature linear ball bearings, ensuring delicate placement and pick up of parts from PCB. Includes seven (7) Vacuum Picks |
| Precision Placement Capability |
Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement. |
| Placement Accuracy | Stepper motor with precision positioning of to 28μm (.0011") accuracy |
| Integrated Board Support Wand |
Standard, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB. |
| Temperature Setting Range | Top Heater: 100 ̊ to 400 ̊ C (212 ̊ - 750 ̊ F); Bottom Heater: 100 ̊ to 221 ̊ C (212 ̊ - 430 ̊ F) |
| Precision PCB Holder | Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges |
| Maximum/Minimum PCB Size | Maximum: 305mm x 305mm (12" x 12"); Minimum: N/A arms close down completely. |
| Maximum/Minimum Component Size | Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq. |
| Thermocouple Inputs |
Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples) |
| High Definition Optical Alignment System |
Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom capability, with Stable Zoom and image stabilization. VOS does not require routine calibration. (Optical Alignment Kit included) |
| Motorized Optics Housing | Automatically controlled, retractable optics housing protects Vision Overlay System from dirt and contamination |
| Quad-Field Imaging |
For outsized component alignment, allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification |
| Single Axis Operation |
All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow. |
| Auxilliary Cooling Fan | Standard |
| Software |
Intuitive, user-friendly, Windows-compatible software guides operators through profile development and execution; No cost upgrades on TF 1800 software |
| Computer System | Windows 8.1 PC, with wireless mouse and keyboard |
| Video Monitor | 607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit) |
| Video Inputs | USB 3.0 |
| Maximum Airflow | Self contained pump, PC controlled, adjustable up to 30 SLPM |
| Nitrogen Capability | Nitrogen soldering and cooling ready |
| Component Nests |
Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq. |
| Heat Focusing, Vented Nozzles | Optional; over 90 nozzles available |
| Flux Application Plate | Included; allows for automated flux dipping |
| Stencils/Solder Paste Application |
Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process |
| PV-65 Pik-Vac Vacuum Wand | Included; provides a manual vacuum pick-up capability for handling SMDs, incorporates new 15 minute auto-off feature |
| Warranty | One Year Limited Warranty |
Accessories Included
| Vacuum Picks |
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| TF 1800 includes seven (7) Vacuum Picks to accommodate a wide variety of large and small SMDs. Comes with 8 O-rings for irregularly surfaced components. An optional 20 gauge Micro Vacuum Pick is also available. |
| Adjustable Component Centering Nests |
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| Two (2) removable and adjustable Component Nests are provided for perfect centering of components, in preparation for vacuum pick-up/placement. In addition, a Small Parts Nest (not shown) is provided for components less than 5mm sq. |
Optionally Available
| Heat Focusing Nozzles |
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| Over 90 standard nozzles are available for BGA, CSP, QFP, SO, QFN and other components. Custom designs can be created to meet specific rework requirements. |
| ADS200 with MT-200 MiniTweez Kit |
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| PACE’s ADS200 with MT-200 kit allows you to rework micro-components such as 0201s, 0402s and 0603s in a simple, one-handed operation. This kit includes the ADS200, with AccuDrive temperature control technology, the new MT-200 MiniTweez®, a precision thermal tweezer that can also handle larger SOTs, D-PAKs, SOICs and TSOPs, as well as an Instant SetBack Tool Stand for automatic tip temperature reduction. |
| Flux Tray Assembly |
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| Allows for automated flux dipping, gel or paste flux application to the balls of a BGA. There are 2 different depths in the plate for small and large solder spheres. |
| Additional Accessories |
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| The TF 1800 comes complete with many additional accessories including: PV-65 PicVac Component Handling Vacuum Wand, Optical Alignment Kit, 2 K-Type Thermocouples, Hot Nozzle/Chip Handling Tool, Nozzle Change Pad, Hex Key Set, 24" Monitor Mounting Arm Kit and more! |
| Stencils & Stencil Bracket Kit |
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| Over 145 standard stencils are available. Both the Universal Stencil Bracket Kit, shown top right with squeegee (stencil shown with bracket not included), and a stencil are required to apply solder paste to the component. |
| ST925 SMT Rework System |
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| The ST925 combines three popular PACE products together into one convenient, low-cost SMT Rework System. The system is comprised of the ST325 Programmable Convective/Hot Air Rework Station, the PH100 Low Profile Infrared Preheater, and ST500A Z-Axis Platform. Together, the system provides a powerful 575 Watt convective top-side heater plus a 1600 Watt IR bottom-side preheater which allows operators to safely rework PCBs. |
Vass, NC 28394
346 Grant Road
Vass, NC28394
phone 910.695.7223
fax 910.695. 1594
www.paceworldwide.com