A WORLDWIDE COMMITMENT
With offices worldwide, PACE is a recognized world leader in the development of solutions for the assembly and repair of highly advanced electronics. Our expertise extends back to the dawn of the modern electronics industry. In 1958, PACE introduced training programs for the repair of printed wire assemblies, and soon after, revolutionized the industry by creating the first self-contained vacuum desoldering system.
Today, PACE continues to provide innovative solutions, products and training for the rework, repair and testing of printed circuit assemblies. Our unique capabilities and evolving vision have provided universal solutions for thru-hole and surface mount assembly and rework problems for the most advanced electronics.
Additionally, PACE manufactures Fume Extraction Systems to reduce exposure to harmful particulates and gases created from hand soldering operations. PACE Fume Extraction Systems effectively remove these contaminants from the worker’s breathing zone thereby reducing or eliminating health risks and improving productivity.
Our strong commitment and history of achievement has resulted in an unparalleled range of Assembly, Repair and Fume Extraction solutions to meet your needs whether working to IS0-9000, industrial, military or your own internal specifications. Whatever the challenge, PACE stands ready to help you set a new standard.
PACE USA
9030 Junction Drive
Annapolis Junction
MD 20701
U.S.A.
Tel: 301-490-9860
Fax: 301-498-3252
PACE EUROPE
Sherbourne House,
Sherbourne Drive
Tilbrook, Milton Keynes,
MK7 8HX
United Kingdom
Tel: (44) 1908-277666
Fax: (44) 1908-277777
INTERNET
www.paceworldwide.com
A CUSTOMER COMMITMENT
In 2001 the distinguished Frost & Sullivan Award for the World Surface Mount Technology Rework and Repair Equipment Industry was bestowed upon PACE.
The Frost & Sullivan Market Engineering Customer Service Leadership Award is presented to companies that have demonstrated superior responsiveness to customer needs
and value-added support in technology and services.
PACE was selected based upon independent research with customers, key market participants and even our competition. This award reiterates PACE’s commitment to excellence from product concept to customer service in the field. Frost & Sullivan’s research recognizes that the key to PACE’s success in the industry is our interactive approach with customers toprovide solutions and respond to end-user feedback when developing products.
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In 2002 PACE was awarded World Class Status, signifying that PACE uses best practices in its design, development and manufacturing processes to provide the finest quality products to its customers at the lowest possible cost. The first Maryland based company to receive this coveted award, PACE stands alone in its market segment in achieving this highly regarded status. |
SOLUTIONS FOR THE ELECTRONICS INTERCONNECTION PROCESS
The following are trademarks and/or service marks of PACE, Incorporated, Annapolis Junction, MD USA: INSTACALTM, ENDURATM, FUMEFLOTM, HI-FLOTM MINITWEEZTM, PACEWORLDWIDETM, POWERMODULETM and POWERPORTTM. The following are registered trademarks and/or service marks of PACE, Incorporated, Annapolis Junction, MD USA: ARM-EVAC®, FLO-D-SODR®, HEATWISE®, MINI-WAVE®, PACE®, PERMAGROUND®, SENSATEMP ®, SNAP-VAC®, SODRTEK®, SODR-X-TRACTOR®, TEMPWISE®, THERMO-DRIVE®, THERMOFLO®, THERMOJET®, THERMOTWEEZ® and VISIFILTER®. PACE products meet or exceed all applicable military and civilian EOS/ESD, temperature stability and other specifications, including MIL-STD-2000, ANSI/J-STD-001, IPC 7711, IPC 7721 and IPC-A-610.
TF 1500 & SYSTEM SOFTWARE
Ideal for post assembly rework, repair and low volume production operations
The TF 1500 is the next generation in automated, cost effective solutions for area array package rework. No other system on the market is easier to use, ensuring operator
acceptance and success! Designed for today’s PCBs, the TF 1500 can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs. The
TF 1500’s PC based software is so advanced that creating profiles has never been easier. The system guides the operator through an intuitive interface that virtually automates the process. All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The PCB holder features fine micrometer adjustment for the most delicate X and Y axis alignments. The twin rail, linear bearings provide precision Z axis movement ensuring placement accuracy to within 25 μm (.001”). The optics boast a 300x zoom camera and the highest quality prism available for amazing image clarity. The TF 1500 uses a combination of Convective top heat with powerful IR bottom heating for the most effective, repeatable heating process available today. The TF 1500 is self-contained and does not require an external air supply or vacuum connections.
For larger applications(max PCB size 610mm x 610mm/24" x 24"), the TF 2500 Area Array Rework System is available. Designed for large & thermally massive pcb rework,
the TF 2500 features a 1200 Watt Convective top-heater and a bottom heater with 7 heating zones which can be independently activated via PC software for maximum control.
Operator friendly interface documents the procedure and eliminates operator mistakes
PRODUCTION SCREEN
• Password lockout ensures process control by restricting operator access to profile parameters.
• Profile process tracked by color-coded “Status Indicator” and graphical user interface (GUI).
• Allows for process validation using two thermocouple inputs.
• Document operations for quality assurance.
• Record PCB/component serial numbers for job tracking.
• Operators can record comments and observations.
• Full system control functions.
• Print function allows for follow up documentation and component profile verification .
PROFILE DEVELOPMENT SCREEN
• Click and Drag Modification feature allows profiles to be developed and modified in real time using PC mouse.
• Choose between installation or removal modes.
• Individual top heater, bottom heater, and time settings for all 4 zones.
• User regulated length of cool down phase.
• Full system control functions.
• Graphical interface of time and temperature parameters with upper and lower temperature limit guides.
• On-demand display of temperature and thermal ramp rate of thermocouple data.
• 4 thermocouple sensor inputs for profile development/monitoring.
• Incorporate work instructions into profiles.
• Save thermal profile data for import into spreadsheet software (not included).
• Verify and compare profiles using “Trial Run Log”.
• Activation of external cooling fan to cool PCB and component to below solder melt temperatures.
ALIGNMENT SCREEN
• View images from Vision Overlay System.
• Control zoom and focus.
• Auto focus On/Off.
• Store and manage images electronically.
• Full screen viewing mode.
• Reference image can be stored with profile for easy component identification.
SETUP SCREEN
• Activate password lockout for Operation Screen.
• Set upper and lower temperature parameters for graphical interface.
• View software in choice of 6 different languages.
• Set back mode and auto off function.
• Access Diagnostic tool.
THE ONLY PRODUCT YOU’LL EVER NEED Flexibility and high performance to meet all your rework requirements
COMPONENT PICK-UP
• Each component is placed into an adjustable nest.
• The nest is placed into position above the optics assembly.
• The reflow head automatically picks up the component and moves it to the proper position for alignment.
• Four component pick-up nozzles are available.
• Flux dipping can be incorporated into the component pick-up procedure.
Nested PBGA about to be picked up by Vacuum pik
COMPONENT ALIGNMENT/PLACEMENT
• High resolution Vision Overlay System (VOS) with color camera and dichroic prism.
• VOS does not require routine calibration, eliminating costly downtime and operator frustration.
• Images are viewed through the PC in standard or full screen viewing modes.
• Accurately places any array package up to 45mm (1.75") square.
• Color camera with 300x zoom and auto-focus capability.
• Retractable optics housing protects VOS from dirt and contamination.
• Independent lighting controls for component and PCB to maximize overlay contrast.
• Different colored lighting for PCB and component create a third color when alignment is achieved.
• Precision Z axis movement ensures placement accuracy.
• Component is placed on PCB with minimal controlled pressure.
• High-flow vacuum pump holds component securely.
PBGA being held by Vacuum pik during Alignment procedure
COMPONENT REFLOW
• Easy programmability ensures process control and successful installation.
• Profiles are created and managed through the PC software.
• Creating the perfect profile is easy with real time adjustment of profile parameters through the PC.
• Store and recall an infinite number of profiles using the PC.
• 2 pre-defined profiles for use as baselines when developing profiles are included.
• The 1200 Watt top heater, with closed loop temperature control, coupled with a unique nozzle design ensures uniform temperature distribution during reflow.
• Fully integrated, powerful IR bottom heater with closed loop temperature control ensures process integrity by delivering heat evenly, time after time.
• High power heaters allow for successful, safe and repeatable reflow at safe, low temperatures.
• 4 thermocouple sensor inputs ensure accurate profile development and monitoring.
• The system is N2 capable.
Nozzle lowering over PBGA for reflow
TF 1500 SPECIFICATIONS & THERMOFLO NOZZLES
| SPECIFICATIONS | |
| Part Numbers | 8007-0410 120 VAC Unit 8007-0411 230 VAC Unit |
| Heater (top side) Bottom Heater | Convective (air or N2),1200 Watts IR, 400 Watts (200 Watts x 2), 220mm x155mm (8.6” x 6.1”) |
| *Heater function continuously monitored by PC closed loop control |
| Max Component size | 45mm x 45mm (1.75” x 1.75”) max |
| Max PCB size | 305mm x 305mm (12” x 12”) |
| Air Flow maximum | Self contained, manual adjust, 20 SLPM |
| N2 Option | Standard |
| Resolution on Optics Adjustment | 0.52mm (0.02”) per rotation |
| Positioning Accuracy (Z axis) | ± 25 μmeters (0.001”) |
| Vacuum | 450mm Hg |
| SPECIFICATIONS | |
| Power requirements | 120 VAC, 60 Hz or 230 VAC, 50 Hz 2000 watts maximum |
| Optics | High resolution, Vision Overlay System |
| Video inputs | 2 Composite Video 1 “S”Video (for alignment optics) |
| Temperature setting range | Top Heater: 100 ̊ to 400 ̊C (212 ̊ to 750 ̊F) Pre-Heater: 100 ̊ to 221 ̊C (212 ̊ to 430 ̊F) |
| Dimensions | 737mm H x 686mm W x 737mm D (29” H x 27” W x 29” D) |
| Weight (Without Computer) | 45kg (100lbs.) |
| Video Monitor Viewable area | 380mm (15”) Integrated Color flat Panel LCD Monitor |
| Board Supports | Included |
| Optical Alignment Kit | Included |
THERMOFLO NOZZLE CHART
| MAXIMUM COMPONENT SIZE | NOZZLE DIMENSIONS | NOZZLE P/N |
| 5mm x 5mm (0.19" x 0.19") | 8mm x 8mm (0.31" x 0.31") | 4038-7001 |
| 6mm x 6mm (0.24" x 0.24") | 9mm x 9mm (0.35" x 0.35") | 4038-7042 |
| 6mm x 8mm (0.24" x 0.31") | 9mm x 11mm (0.35" x 0.43") | 4038-7002 |
| 7.3mm x 7mm (0.29" x 0.28") | 10.3mm x 10mm (0.40" x 0.40") | 4038-7040 |
| 8mm x 8mm (0.31" x 0.31") | 11mm x 11mm (0.43" x 0.43") | 4038-7041 |
| 8.1mm x 8.1mm (0.31” x 0.31”) | 11.1mm x 11.1mm (0.43” x 0.43”) | 4038-7055 |
| 8.2mm x 12.7mm (0.32" x 0.50") | 11.2mm x 15.7mm (0.44" x 0.62") | 4038-7003 |
| 9mm x 9mm (0.35" x 0.35") | 12mm x 12mm (0.47" x 0.47") | 4038-7004 |
| 10mm x 10mm (0.39" x 0.39") | 13mm x 13mm (0.51" x 0.51") | 4038-7005 |
| 11.4mm x 5.1mm (0.49” x 020) | 14.4mm x 8.1mm (0.56” x 0.31”) | 4038-7050 |
| 13mm x 10mm (0.51" x 0.40") | 16mm x 13mm (0.63" x 0.51") | 4038-7039 |
| 13mm x 13mm (0.51" x 0.51") | 16mm x 16mm (0.63" x 0.63") | 4038-7006 |
| 14mm x 22mm (0.55" x 0.87") | 17mm x 25mm (0.67" x 0.99") | 4038-7021 |
| 15mm x 15mm (0.59" x 0.59") | 18mm x 18mm (0.71" x 0.71") | 4038-7007 |
| 15.34mm x 12.7mm (0.60” x 0.50”) | 18.34mm x 15.7mm (0.72” x 0.61”) | 4038-7063 |
| 15.6mm x 5.1mm (0.61” x 0.20”) | 18.6mm x 8.1mm (0.73” x 0.31”) | 4038-7062 |
| 16.5mm x 8mm (0.65" x 0.31") | 19.5mm x 11mm (0.77" x 0.43") | 4038-7027 |
| 17mm x 11mm (0.67” x 0.43”) | 20mm x 14mm (0.79” x 0.55”) | 4038-7052 |
| 17mm x 17mm (0.67" x 0.67") | 20mm x 20mm (0.79" x 0.79") | 4038-7008 |
| 19mm x 19mm (0.75" x 0.75") | 22mm x 22mm (0.87" x 0.87") | 4038-7026 |
| 20mm x 8mm (0.79” x 0.31”) | 23mm x 11mm (0.90” x 0.43”) | 4038-7058 |
| 20mm x 20mm (0.79” x 0.79”) | 23mm x 23mm (0.90” x 0.90”) | 4038-7061 |
| 21mm x 12.75mm (0.83” x 0.50”) | 24mm x 15.75mm (0.94” x 0.62”) | 4038-7060 |
| 21mm x 25mm (0.83" x 0.98") | 23mm x 28mm (0.91" x 1.1") | 4038-7029 |
| 22mm x 22mm (0.86” x 0.86”) | 25mm x 25mm (0.98” x 0.98”) | 4038-7057 |
| 23mm x 23mm (0.90" x 0.90") | 26mm x 26mm (1.02" x 1.02") | 4038-7009 |
| 25mm x 25mm (0.98" x 0.98") | 28mm x 28mm (1.1" x 1.1") | 4038-7025 |
| 27mm x 27mm (1.06" x 1.06") | 30mm x 30mm (1.18" x 1.18") | 4038-7010 |
| 28mm x 16mm (1.1" x 0.63") | 31mm x 19mm (1.22" x 0.75") | 4038-7038 |
| 28mm x 28mm (1.1" x 1.1") | 31mm x 31mm (1.22" x 1.22") | 4038-7048 |
| 28.5mm x 17mm (1.12” x 0.67”) | 31.5mm x 20mm (1.12” x 0.79”) | 4038-7059 |
| 29mm x 29mm (1.14" x 1.14") | 32mm x 32mm (1.26" x 1.26") | 4038-7030 |
| 30mm x 30mm (1.18" x 1.18") | 33mm x 33mm (1.3" x 1.3") | 4038-7044 |
| 31mm x 31mm (1.22" x 1.22") | 33mm x 33mm (1.3" x 1.3") | 4038-7031 |
| 32mm x 17mm (1.26” x 0.67”) | 35mm x 20mm (1.37” x 0.79”) | 4038-7053 |
| 32.5mm x 23mm (1.28” x 0.90”) | 35.5mm x 26mm (1.40” x 1.02”) | 4038-7051 |
| 32.5mm x 25mm (1.28” x 0.98”) | 35.5mm x 28mm (1.40” x 1.1”) | 4038-7056 |
| 33mm x 33mm (1.29" x 1.29") | 36mm x 36mm (1.42" x 1.42") | 4038-7028 |
| 35mm x 35mm (1.37" x 1.37") | 38mm x 38mm (1.5" x 1.5") | 4038-7011 |
| 38.1mm x 25.8mm (1.50” x 1.01”) | 41.1mm x 28.8mm (1.61” x 1.13”) | 4038-7066 |
| 40mm x 40mm (1.57" x 1.57") | 43mm x 43mm (1.7" x 1.7") | 4038-7024 |
| 41mm x 41mm (1.61" x 1.61") | 43mm x 43mm (1.7" x 1.7") | 4038-7047 |
| 42mm x 42mm (1.65" x 1.65") | 45mm x 45mm (1.77" x 1.77") | 4038-7032 |
| 42.5mm x 32.5mm (1.67” x 1.40”) | 45.5mm x 35.5mm (1.80” x 1.39”) | 4038-7054 |
| 43mm x 43mm (1.7" x 1.7") | 46mm x 46mm (1.81" x 1.81") | 4038-7045 |
| 44mm x 33mm (1.73” x 1.29”) | 47mm x 36mm (1.85” x 1.41”) | 4038-7064 |
| 44mm x 44mm (1.73" x 1.73") | 47mm x 47mm (1.85" x 1.85") | 4038-7043 |
| 44.5mm x 44.5mm (1.75" x 1.75") | 47.5mm x 47.5mm (1.87" x 1.87") | 4038-7012 |
| 46mm x 46mm (1.81" x 1.81") | 49mm x 49mm (1.93" x 1.93") | 4038-7046 |
| 48mm x 48mm (1.89" x 1.89") | 51mm x 51mm (2" x 2") | 4038-7049 |
| 50mm x 50mm (1.97" x 1.97") | 53mm x 53mm (2.1" x 2.1") | 4038-7022 |
| 56mm x 17mm (2.2" x 0.67") | 59mm x 20mm (2.32" x 0.79") | 4038-7037 |
| 60mm x 60mm (2.36" x 2.36") | 63mm x 63mm (2.5" x 2.5") | 4038-7023 |
| Connector, 16mm x 13mm (0.63" x 0.51") | 19mm x 16mm (0.75" x 0.63") | 4038-7033 |
| Connector, 19mm x 8mm (0.75" x 0.31") | 22mm x 11mm (0.87" x 0.43") | 4038-7036 |
| Connector, 27mm x 13mm (1.06" x 0.51") | 30mm x 16mm (1.18" x 0.63") | 4038-7034 |
| Connector, 30mm x 12mm(1.18" x 0.47") | 33mm x 15mm (1.3" x 0.59") | 4038-7035 |
| LQFP 9mm x 9mm (0.35" x 0.35") | 12mm x 12mm (0.47" x 0.47") | 4038-7016 |
| LQFP 12mm x 12mm (0.47" x 0.47") | 15mm x 15mm (0.59" x 0.59") | 4038-7017 |
| LQFP 14mm x 14mm (0.55" x 0.55") | 17mm x 17mm (0.67" x 0.67") | 4038-7020 |
| LQFP 16mm x 16mm (0.63" x 0.63") | 19mm x 19mm (0.75" x 0.75") | 4038-7014 |
| LQFP 16mm x 22mm (0.63" x 0.87") | 19mm x 25mm (0.75" x 0.99") | 4038-7019 |
| LQFP 22mm x 22mm (0.87" x 0.87") | 25mm x 25mm (0.98" x 0.98") | 4038-7013 |
| LQFP 26mm x 26mm (1.02" x 1.02") | 29mm x 29mm (1.14" x 1.14") | 4038-7018 |
| LQFP 30mm x 30mm (1.18" x 1.18") | 33mm x 33mm (1.29" x 1.29") | 4038-7015 |
Please visit www.paceworldwide.com for more information on the wide range of PACE’s Nozzles, Component Stenciling and Reballing Kits.
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XR 3000 BGA/CSP INSPECTION SYSTEM
Real-time X-ray gives immediate feedback.
The XR 3000 is ideal for inspecting BGAs, CSPs, and other electronic components. The XR 3000 provides immediate feedback on your process using real time images. Images can be viewed through PACE’s ThermoFlo software or through an optional, flat screen, LCD monitor (P/N 7015-0010) when used as a stand-alone unit.
The XR 3000 has been designed with rework in mind so it is able to fit easily on the benchtop and can be relocated quickly. Featuring patented camera technology and outstanding zoom capability, the XR 3000 is able to identify a wide range of anomalies, as small as .025mm (.001”). Using PACE’s ThermoFlo software (via TF 1500 & TF 2500), images can be viewed, stored electronically, and managed. Defect analysis reports with images can be easily created.
When integrated with TF 1500 or TF 2500 software, the XR 3000 system can actually teach operators how to identify defects using the defect image library. Examples of common defects are included with the software that operators can refer to compare the live image of their work with the reference image. The library can be added to and modified so you can provide images of the actual work to the operator for immediate comparison.
AREA ARRAY INTERCONNECTION ANOMALIES IDENTIFIED BY THE XR 3000
| BRIDGING | MISSING SOLDER BALLS | SOLDER VOIDS | SOLDER BALLS | COLD SOLDER |
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| Bridging between solder joints is easily identified. | Missing solder balls can be identified easily. | Solder voids | Solder balls in the center of the package are oversized due to delamination and compression under die area | Cold solder is signified by a jagged, irregular edge around the perimeter of the solder ball. Note that in this image only some of the balls show this signature. |
AVOID REJECTING GOOD BOARDS , WITH PACE’S PATENTED CAMERA TECHNOLOGY
Voltage blooming is associated with the X-ray camera used in many X-ray inspection systems. The phenomenon occurs when voltage is increased, causing the white area
of the X-ray image (the void) to expand (or bloom) and encroach on the black area.
This makes a void appear larger than it really is. A void that occupies 10% of a solder sphere at 50 kV may appear to consume up to 50% of the solder sphere at 70 kV. The patented camera technology found in PACE’s XR 3000 is the only system of its type not subject to Voltage Blooming. The camera technology ensures that void sizes remain consistent.
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XR 3000 FEATURES AND SPECIFICATIONS
X-Ray inspection for the benchtop.
| FEATURES/SPECIFICATIONS | XR 3000 |
| POWER REQUIREMENTS | 115 VAC, 60 Hz or 230 VAC, 50/60 Hz 1000 Watts maximum |
| X-RAY TUBE | 50 kv |
| COLOR CAMERA | High resolution with 7-40x zoom |
| MAXIMUM PCB SIZE | 760mm x unlimited (30" x unlimited) |
| FOCAL SPOT | 0.2mm (0.008") |
| FOCAL SPOT TO IMAGE PLANE DISTANCE | 124mm (4.875") |
| ADJUSTMENTS | Live or Capture video signal options. Video Gain adjustment |
| CONTRAST RESOLUTION | Can resolve a 0.25mm (.001”) gold wire |
| SPATIAL RESOLUTION | 20lp/mmv |
| X-RAY ACTUATION | Foot Pedal |
| OPENING CLEARANCE | 40mm (1.5”) 120 VAC, 19mm (0.75”) 230 VACv |
| PCB FIXTURE DEVICE | Standard |
| SMALL PCB CARRIER | Standard |
| DIMENSIONS | 394mm H x 457mm W x 585mm D (15.5" H x 18" W x 23" D) |
| WEIGHT | 39Kg (86 lbs.) |
| DESCRIPTION | PART NUMBER |
| XR 3000 120 VAC | 8007-0385 |
| XR 3000 230 VAC | 8007-0386 |
SUPPORT PRODUCTS FOR AREA ARRAY REWORK
PACE provides a full solution for Area Array Rework
The LS 3000 from PACE is the newest, cost effective, optical inspection system specifically designed for today’s electronics. Its primary use is for inspection of area array devices (PBGA,CSPs, Flip Chips, LGAs, CBGAs, etc.). However, the LS 3000 has a wide range of other inspection uses on any SMT or thru-hole based PCB. The LS 3000 is ideal for periodically monitoring the performance of production or rework reflow equipment. It is also a critical inspection/monitoring instrument for R&D labs and process development departments when developing new processes or troubleshooting problems.
| COMPONENT STENCILING TOOLS AND STENCILS | FLUX APPLICATOR |
| Applies solder paste to component, reducing the difficulty and mess associated with PCB stenciling. | Allows for precise and repeatable application of flux by dipping component. |
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TRAINING
PACE offers one of the most advanced operator training courses available, PCT-500 Advanced Surface Mount Rework and Repair. Heavy emphasis is placed on profiling, positioning, installation and removal of grid array style components such as BGAs and flip chips. Area array component preparation including flux and/or solder paste stenciling, component reballing and advanced inspection methods using X-Ray are all covered. Finally, land replacement or repair is also practiced.
LS 3000
PRODUCT PAGE
For a complete product listing contact PACE or visit www.paceworldwide.com
PACE provides innovative solutions, products and training for the assembly, rework, repair and testing of printed circuit boards. PACE’s unique capabilities and evolving vision have provided universal solutions to thru-hole and surface-mount assembly and rework problems for the most advanced electronics. Our strong commitment
| HEAT WISE/TEMPWISE | HW 100 | TW 100 | HW 200 | MTS 300 |
| HeatWise and TempWise systems feature a handpiece possessing the latest in ergonomic design and operator comfort and use replaceable tip/heater cartridge(s). The ability to change performance level without having to change tips results in significant cost savings and inventory reduction. |  |
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| ST SYSTEMS | ST 25 | ST 45 | ST 85 | ST 115 |
This product line offers three basic configurations: |
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| MBT/PRC SYSTEMS | MBT 250 | PRC 2000 |
| PACE offers a broad range of rework and repair products to meet all your repair needs. Whether you are replacing a surface mount component, repairing a multi-layer printed circuit board, or making a plated thru-hole repair. |  |
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| SODR-TEK SYSTEMS | HEATWISE | SENSATEMP | PRE-HEATERS & FIXTURES | CONVECTIVE SMT |
| Sodr-Tek systems are modular and integrate with each other, allowing technicians to purchase only the tools required for today without sacrificing the needs of tomorrow. Sodr-Tek products have been designed to meet the changing needs of today's service and benchtop technicians. |  |
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| FUME EXTRACTION | ARM-EVAC 50 | ARM-EVAC 105 | FUMEFLO WORKTABLE | ARM-EVAC 250 |
| PACE offers Fume Extraction Systems that feature the latest advancements in filter condition monitoring and process control as well as cost effective solutions. A variety of collection accessories are available. |
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