{"product_id":"pace-4028-5502-bga-48-bga-micro-hot-air-nozzle-7-85-x-6-4mm","title":"Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle, 7.85 x 6.4mm","description":"\u003cstyle\u003e#html-body [data-pb-style=MYAGC0Y]{justify-content:flex-start;display:flex;flex-direction:column;background-position:left top;background-size:cover;background-repeat:no-repeat;background-attachment:scroll}\u003c\/style\u003e\u003cdiv data-content-type=\"row\" data-appearance=\"contained\" data-element=\"main\"\u003e\u003cdiv data-enable-parallax=\"0\" data-parallax-speed=\"0.5\" data-background-images=\"{}\" data-background-type=\"image\" data-video-loop=\"true\" data-video-play-only-visible=\"true\" data-video-lazy-load=\"true\" data-video-fallback-src=\"\" data-element=\"inner\" data-pb-style=\"MYAGC0Y\"\u003e\n\u003ch2 data-content-type=\"heading\" data-appearance=\"default\" data-element=\"main\"\u003ePace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle, 7.85 x 6.4mm\u003c\/h2\u003e\n\u003cdiv data-content-type=\"text\" data-appearance=\"default\" data-element=\"main\"\u003e\n\u003cp id=\"L3K1BUA\"\u003eThe Pace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle is a specialized tool designed for the precise soldering and desoldering of Ball Grid Array (BGA) components with 48 balls. Tailored for applications in surface mount technology (SMT) and electronics manufacturing, this hot air nozzle provides targeted and controlled heat for accurate soldering and desoldering processes.\u003c\/p\u003e\r\n\u003ch3\u003e\u003cspan style=\"font-size: 18px;\"\u003ePace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle Highlights:\u003c\/span\u003e\u003c\/h3\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eSpecifically designed to accommodate BGA components with 48 balls, ensuring a precise fit for efficient and effective soldering or desoldering\u003c\/li\u003e\r\n\u003cli\u003eThe BGA-48 Micro Hot Air Nozzle is designed for easy attachment and removal, streamlining the nozzle changeover process during production or rework\u003c\/li\u003e\r\n\u003cli\u003eThe micro-sized nozzle allows for intricate work on densely populated circuit boards, enabling technicians to focus heat precisely on the BGA component without affecting nearby components\u003c\/li\u003e\r\n\u003cli\u003eConstructed from durable materials, this hot air nozzle is built to withstand the demands of industrial use, providing longevity and reliability in electronics manufacturing processes\u003c\/li\u003e\r\n\u003c\/ul\u003e\r\n\u003ch3\u003e\u003cspan style=\"font-size: 18px;\"\u003ePace 4028-5502 BGA-48 BGA Micro Hot Air Nozzle Specs:\u003c\/span\u003e\u003c\/h3\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eBrand: \u003ca tabindex=\"0\" href=\"\/collections\/pace\"\u003ePace\u003c\/a\u003e\n\u003c\/li\u003e\r\n\u003cli\u003eSKU: 4028-5502\u003c\/li\u003e\r\n\u003cli\u003eType: Standard\u003c\/li\u003e\r\n\u003cli\u003eNozzle Style: BGA\u003c\/li\u003e\r\n\u003cli\u003eProduct Type: Hot Air Nozzle\u003c\/li\u003e\r\n\u003cli\u003eLead Free Solder Compatible: Yes\u003c\/li\u003e\r\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\u003c\/div\u003e","brand":"PACE","offers":[{"title":"Default Title","offer_id":46478949384391,"sku":"PAC4028-5502","price":236.5,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0780\/0343\/7767\/files\/4028-5502-p1_1.png?v=1777619435","url":"https:\/\/technimark-inc.com\/products\/pace-4028-5502-bga-48-bga-micro-hot-air-nozzle-7-85-x-6-4mm","provider":"Technimark-Inc","version":"1.0","type":"link"}